Meet IMS Group USA at PACK EXPO Chicago 2026

PACK EXPO Chicago is right around the corner, and IMS Group USA is excited to be back showcasing the latest in packaging automation and innovation.

Join us this October at Booth N-5974, where we'll be featuring two innovative packaging solutions: the Nicetuck™ Adhesive-Free Case Packer and the MyWay Stand-Up Pouch Packaging Machine.

See the Latest Packaging Technology in Action

Nicetuck™ Adhesive-Free Case Packer

Discover a smarter approach to case packing. Nicetuck eliminates the need for hot melt glue or tape, helping manufacturers reduce consumable costs, simplify maintenance, improve sustainability, and create secure, shipping-ready cases.

MyWay Stand-Up Pouch Packaging Machine

Explore flexible automation for today's growing stand-up pouch market. MyWay is designed to support efficient, reliable pouch packaging across a variety of products and applications.

Let's Talk Packaging

Our team is currently scheduling meetings and live demonstrations throughout the show. If you're attending PACK EXPO Chicago, we'd love to learn more about your packaging needs and show you what IMS Group USA can bring to your operation.

📍 Visit IMS Group USA at Booth N- 5974

Ready to connect? Schedule a meeting with our team at PACK EXPO Chicago.